Electronic Packaging of High Speed Circuitry
| AUTHOR | Helland, Arden R.; Konsowski, Stephen G.; Helland, Arlen R. |
| PUBLISHER | McGraw-Hill Professional Publishing (05/01/1997) |
| PRODUCT TYPE | Hardcover (Hardcover) |
Description
Presenting guidelines for designing and packaging high-speed circuitry, this work details the role of materials selection and also covers manufacturing considerations.
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Product Format
Product Details
ISBN-13:
9780070359703
ISBN-10:
0070359709
Binding:
Hardback or Cased Book (Sewn)
Content Language:
English
More Product Details
Page Count:
445
Carton Quantity:
14
Product Dimensions:
6.28 x 1.44 x 9.27 inches
Weight:
1.76 pound(s)
Feature Codes:
Bibliography,
Index,
Illustrated
Country of Origin:
US
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Microelectronics
Technology & Engineering | Electrical
Technology & Engineering | Telecommunications
Dewey Decimal:
621.381
Library of Congress Control Number:
97001904
Descriptions, Reviews, Etc.
jacket back
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
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publisher marketing
Presenting guidelines for designing and packaging high-speed circuitry, this work details the role of materials selection and also covers manufacturing considerations.
Show More
List Price $65.00
Your Price
$64.35
