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Proceedings of the 7th International Conference on Knowledge Innovation and Invention, Volume 2: Proceedings of Ickii 2024, Volume 2

PUBLISHER Springer (10/21/2025)
PRODUCT TYPE Hardcover (Hardcover)

Description

This volume represents the proceedings of the 7th International Conference on Knowledge Innovation and Invention 2024 (ICKII 2024). This conference is organized by IEEE Tainan Section Sensors Council, National Formosa University of Taiwan, and International Institute of Knowledge Innovation and Invention (IIKII), and held on August 16-18, 2024, in Nagoya, Aichi, Japan. The conference provided a unified communication platform for researchers in a range of topics, such as information technology, communication science & engineering, computer science, electrical & electronic engineering, automation engineering, big data computation, machine learning, and other engineering related fields. This proceedings volume enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally.

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Product Format
Product Details
ISBN-13: 9789819519408
ISBN-10: 9819519403
Binding: Hardback or Cased Book (Sewn)
Content Language: English
More Product Details
Page Count: 288
Carton Quantity: 24
Product Dimensions: 6.14 x 0.69 x 9.21 inches
Weight: 1.31 pound(s)
Feature Codes: Illustrated
Country of Origin: NL
Subject Information
BISAC Categories
Technology & Engineering | Electrical
Technology & Engineering | Database Administration & Management
Technology & Engineering | Probability & Statistics - General
Descriptions, Reviews, Etc.
jacket back

This volume represents the proceedings of the 7th International Conference on Knowledge Innovation and Invention 2024 (ICKII 2024). This conference is organized by IEEE Tainan Section Sensors Council, National Formosa University of Taiwan, and International Institute of Knowledge Innovation and Invention (IIKII), and held on August 16-18, 2024, in Nagoya, Aichi, Japan. The conference provided a unified communication platform for researchers in a range of topics, such as information technology, communication science & engineering, computer science, electrical & electronic engineering, automation engineering, big data computation, machine learning, and other engineering related fields. This proceedings volume enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally.

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List Price $299.99
Your Price  $296.99
Hardcover