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Nanometer CMOS ICS: From Basics to Asics

AUTHOR J. M. Veendrick, Harry
PUBLISHER Springer (05/08/2017)
PRODUCT TYPE Hardcover (Hardcover)

Description
This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.
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Product Format
Product Details
ISBN-13: 9783319475950
ISBN-10: 3319475959
Binding: Hardback or Cased Book (Sewn)
Content Language: English
Edition Number: 0002
More Product Details
Page Count: 611
Carton Quantity: 6
Product Dimensions: 7.00 x 1.38 x 10.00 inches
Weight: 2.95 pound(s)
Country of Origin: NL
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Circuits - General
Dewey Decimal: 621.381
Descriptions, Reviews, Etc.
jacket back
This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.
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List Price $159.99
Your Price  $158.39
Hardcover